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Authors:
Ban, Yijie |
Zhou, Meng |
Zhang, Yi |
Jia, Yanlin |
Pang, Yong |
Li, Yunzhang |
Tang, Shunlong |
Li, Xu |
Volinsky, Alex A. |
Marchenko, Ekaterina S.
Source: Materials and design. 2023. Vol. 228. P. 111819 (1-10)
Type: статьи в журналах
Date: 2023
Description:
In the present work, the Cu-1.35Ni-1Co-0.55Si alloy with multiple twins and ultra-low interfacial mismatch precipitates was obtained by liquid nitrogen dynamic plastic deformation (DPD) and aging trea
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Authors:
Zhou, Meng |
Geng, Yongfeng |
Zhang, Yi |
Ban, Yijie |
Li, Xu |
Jia, Yanlin |
Liang, Shengli |
Tian, Baohong |
Liu, Yong |
Volinsky, Alex A.
Source: Materials characterization. 2022. Vol. 195. P. 112494 (1-9)
Type: статьи в журналах
Date: 2022
Description:
Copper alloys are widely used as lead frames, electric contact wires and pantographs due to their high electrical conductivity and excellent mechanical properties. At present work, a medium electrical
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